Tra cứu Tiêu chuẩn quốc tế
Tìm thấy 1200 kết quả.
Searching result
| 181 |
ASTM D1601-18Standard Test Method for Dilute Solution Viscosity of Ethylene Polymers Standard Test Method for Dilute Solution Viscosity of Ethylene Polymers |
| 182 |
ASTM F2601-18Standard Specification for Fire Safety for Candle Accessories Standard Specification for Fire Safety for Candle Accessories |
| 183 |
BS ISO 3601-3:2005+A1:2018Fluid power systems. O-rings. Quality acceptance criteria Fluid power systems. O-rings. Quality acceptance criteria |
| 184 |
EN ISO 80601-2-55:2018Medical electrical equipment - Part 2-55: Particular requirements for the basic safety and essential performance of respiratory gas monitors (ISO 80601-2-55:2018) Medical electrical equipment - Part 2-55: Particular requirements for the basic safety and essential performance of respiratory gas monitors (ISO 80601-2-55:2018) |
| 185 |
|
| 186 |
IEC 60156:2018
Insulating liquids - Determination of the breakdown voltage at power frequency - Test method |
| 187 |
IEC 60156:2018 RLV
Insulating liquids - Determination of the breakdown voltage at power frequency - Test method |
| 188 |
IEC 60189-1:2018
Low-frequency cables and wires with PVC insulation and PVC sheath - Part 1: General test and measuring methods |
| 189 |
IEC 60189-1:2018 RLV
Low-frequency cables and wires with PVC insulation and PVC sheath - Part 1: General test and measuring methods |
| 190 |
IEC 60191-1:2018
Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices |
| 191 |
IEC 60191-2:1966/AMD20:2018
Amendment 20 - Mechanical standardization of semiconductor devices - Part 2: Dimensions |
| 192 |
IEC 60191-4:2013/AMD1:2018
Amendment 1 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages |
| 193 |
IEC 60191-4:2013+AMD1:2018 CSV
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages |
| 194 |
|
| 195 |
IEC 60601-2-16:2018
Medical electrical equipment - Part 2-16: Particular requirements for basic safety and essential performance of haemodialysis, haemodiafiltration and haemofiltration equipment |
| 196 |
IEC 60601-2-16:2018 RLV
Medical electrical equipment - Part 2-16: Particular requirements for basic safety and essential performance of haemodialysis, haemodiafiltration and haemofiltration equipment |
| 197 |
IEC 60601-2-39:2018
Medical electrical equipment - Part 2-39: Particular requirements for basic safety and essential performance of peritoneal dialysis equipment |
| 198 |
IEC 60601-2-39:2018 RLV
Medical electrical equipment - Part 2-39: Particular requirements for basic safety and essential performance of peritoneal dialysis equipment |
| 199 |
IEC 60601-2-4:2010/AMD1:2018
Amendment 1 - Medical electrical equipment - Part 2-4: Particular requirements for the basic safety and essential performance of cardiac defibrillators |
| 200 |
IEC 60601-2-4:2010+AMD1:2018 CSV
Medical electrical equipment - Part 2-4: Particular requirements for the basic safety and essential performance of cardiac defibrillators |



