Tra cứu Tiêu chuẩn quốc tế
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23821 |
IEC 60050-151:2001/AMD1:2013
Amendment 1 - International Electrotechnical Vocabulary (IEV) - Part 151: Electrical and magnetic devices |
23822 |
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23823 |
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23824 |
IEC 60050-902:2013
International Electrotechnical Vocabulary (IEV) - Part 902: Conformity assessment |
23825 |
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23826 |
IEC 60061-1:1969/AMD49:2013
Amendment 49 - Lamp caps and holders together with gauges for the control of interchangeability and safety - Part 1: Lamp caps |
23827 |
IEC 60061-2:1969/AMD46:2013
Amendment 46 - Lamp caps and holders together with gauges for the control of interchangeability and safety - Part 2: Lampholders |
23828 |
IEC 60061-3:1969/AMD47:2013
Amendment 47 - Lamp caps and holders together with gauges for the control of interchangeability and safety - Part 3: Gauges |
23829 |
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23830 |
IEC 60068-2-55:2013
Environmental testing - Part 2-55: Tests - Test Ee and guidance - Loose cargo testing including bounce |
23831 |
IEC 60068-2-57:2013
Environmental testing - Part 2-57: Tests - Test Ff: Vibration - Time-history and sine-beat method |
23832 |
IEC 60068-2-65:2013
Environmental testing - Part 2-65: Tests - Test Fg: Vibration - Acoustically induced method |
23833 |
IEC 60076-14:2013
Power transformers - Part 14: Liquid-immersed power transformers using high-temperature insulation materials |
23834 |
IEC 60076-3:2013
Power transformers - Part 3: Insulation levels, dielectric tests and external clearances in air |
23835 |
IEC 60079-14:2013
Explosive atmospheres - Part 14: Electrical installations design, selection and erection |
23836 |
IEC 60079-17:2013
Explosive atmospheres - Part 17: Electrical installations inspection and maintenance |
23837 |
IEC 60079-31:2013
Explosive atmospheres - Part 31: Equipment dust ignition protection by enclosure "t" |
23838 |
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23839 |
IEC 60092-501:2013
Electrical installations in ships - Part 501: Special features - Electric propulsion plant |
23840 |
IEC 60191-4:2013
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages |