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| 26901 |
IEC 60050-732:2010
International Electrotechnical Vocabulary (IEV) - Part 732: Computer network technology |
| 26902 |
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| 26903 |
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| 26904 |
IEC 60061-1:1969/AMD43:2010
Amendment 43 - Lamp caps and holders together with gauges for the control of interchangeability and safety - Part 1: Lamp caps |
| 26905 |
IEC 60061-1:1969/AMD44:2010
Amendment 44 - Lamp caps and holders together with gauges for the control of interchangeability and safety - Part 1: Lamp caps |
| 26906 |
IEC 60061-2:1969/AMD40:2010
Amendment 40 - Lamp caps and holders together with gauges for the control of interchangeability and safety - Part 2: Lampholders |
| 26907 |
IEC 60061-2:1969/AMD41:2010
Amendment 41 - Lamp caps and holders together with gauges for the control of interchangeability and safety - Part 2: Lampholders |
| 26908 |
IEC 60061-3:1969/AMD41:2010
Amendment 41 - Lamp caps and holders together with gauges for the control of interchangeability and safety - Part 3: Gauges |
| 26909 |
IEC 60061-3:1969/AMD42:2010
Amendment 42 - Lamp caps and holders together with gauges for the control of interchangeability and safety - Part 3: Gauges |
| 26910 |
IEC 60061-4:1990/AMD13:2010
Amendment 13 - Lamp caps and holders together with gauges for the control of interchangeability and safety - Part 4: Guidelines and general information |
| 26911 |
IEC 60068-2-53:2010
Environmental testing - Part 2-53: Tests and guidance - Combined climatic (temperature/humidity) and dynamic (vibration/shock) tests |
| 26912 |
IEC 60071-1:2006/AMD1:2010
Amendment 1 - Insulation co-ordination - Part 1: Definitions, principles and rules |
| 26913 |
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| 26914 |
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| 26915 |
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| 26916 |
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| 26917 |
IEC 60122-3:2010
Quartz crystal units of assessed quality - Part 3: Standard outlines and lead connections |
| 26918 |
IEC 60143-4:2010
Series capacitors for power systems - Part 4: Thyristor controlled series capacitors |
| 26919 |
IEC 60191-6-18:2010
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) |
| 26920 |
IEC 60191-6-19:2010
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage |
