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| 27021 |
IEC 60745-2-17:2010
Hand-held motor-operated electric tools - Safety - Part 2-17: Particular requirements for routers and trimmers |
| 27022 |
IEC 60745-2-19:2005/AMD1:2010
Amendment 1 - Hand-held motor-operated electric tools - Safety - Part 2-19: Particular requirements for jointers |
| 27023 |
IEC 60745-2-19:2005+AMD1:2010 CSV
Hand-held motor-operated electric tools - Safety - Part 2-19: Particular requirements for jointers |
| 27024 |
IEC 60745-2-3:2006/AMD1:2010
Amendment 1 - Hand-held motor-operated electric tools - Safety - Part 2-3: Particular requirements for grinders, polishers and disk-type sanders |
| 27025 |
IEC 60745-2-3:2006+AMD1:2010 CSV
Hand-held motor-operated electric tools - Safety - Part 2-3: Particular requirements for grinders, polishers and disk-type sanders |
| 27026 |
IEC 60745-2-5:2010
Hand-held motor-operated electric tools - Safety - Part 2-5: Particular requirements for circular saws |
| 27027 |
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| 27028 |
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| 27029 |
IEC 60747-14-1:2010
Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors |
| 27030 |
IEC 60747-14-5:2010
Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor |
| 27031 |
IEC 60747-15:2010
Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices |
| 27032 |
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| 27033 |
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| 27034 |
IEC 60749-15:2010
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices |
| 27035 |
IEC 60749-19:2003/AMD1:2010
Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength |
| 27036 |
IEC 60749-19:2003+AMD1:2010 CSV
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength |
| 27037 |
IEC 60749-32:2002/AMD1:2010
Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) |
| 27038 |
IEC 60749-32:2002+AMD1:2010 CSV
Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) |
| 27039 |
IEC 60749-34:2010
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling |
| 27040 |
IEC 60763-1:2010
Laminated pressboard for electrical purposes - Part 1: Definitions, classification and general requirements |
