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| 33621 |
IEC 60061-3:1969/AMD25:2001
Amendment 25 - Lamp caps and holders together with gauges for the control of interchangeability and safety. Part 3: Gauges |
| 33622 |
IEC 60061-3:1969/AMD26:2001
Amendment 26 - Lamp caps and holders together with gauges for the control of interchangeability and safety. Part 3: Gauges |
| 33623 |
IEC 60061-4:1990/AMD7:2001
Amendment 7 - Lamp caps and holders together with gauges for the control of interchangeability and safety. Part 4: Guidelines and general information |
| 33624 |
IEC 60068-3-4:2001
Environmental testing - Part 3-4: Supporting documentation and guidance - Damp heat tests |
| 33625 |
IEC 60068-3-7:2001
Environmental testing - Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load) |
| 33626 |
IEC 60077-3:2001
Railway applications - Electric equipment for rolling stock - Part 3: Electrotechnical components - Rules for d.c. circuit-breakers |
| 33627 |
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| 33628 |
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| 33629 |
IEC 60191-2:1966/AMD1:2001
Amendment 1 - Mechanical standardization of semiconductor devices - Part 2: Dimensions |
| 33630 |
IEC 60191-2:1966/AMD2:2001
Amendment 2 - Mechanical standardization of semiconductor devices - Part 2: Dimensions |
| 33631 |
IEC 60191-2:1966/AMD3:2001
Amendment 3 - Mechanical standardization of semiconductor devices - Part 2: Dimensions |
| 33632 |
IEC 60191-2:1966/AMD4:2001
Amendment 4 - Mechanical standardization of semiconductor devices - Part 2: Dimensions |
| 33633 |
IEC 60191-6-1:2001
Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals |
| 33634 |
IEC 60191-6-2:2001
Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages |
| 33635 |
IEC 60191-6-5:2001
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) |
| 33636 |
IEC 60191-6-6:2001
Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA) |
| 33637 |
IEC 60191-6-8:2001
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP) |
| 33638 |
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| 33639 |
IEC 60227-6:2001
Polyvinyl chloride insulated cables of rated voltages up to and including 450/750 V - Part 6: Lift cables and cables for flexible connections |
| 33640 |
IEC 60264-5-2:2001
Packaging of winding wires - Part 5-2: Cylindrical barrelled delivery spools with conical flanges - Specification for returnable spools made from thermoplastic material |
