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Tìm thấy 73948 kết quả.
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| 51841 |
DIN EN 60168*VDE 0674-1Tests on indoor and outdoor post insulators of ceramic material or glass for systems with nominal voltages greater than 1 kV (IEC 60168:1994 + A1:1997 + A2:2000); German version EN 60168:1994 + A1:1997 + A2:2000 Tests on indoor and outdoor post insulators of ceramic material or glass for systems with nominal voltages greater than 1 kV (IEC 60168:1994 + A1:1997 + A2:2000); German version EN 60168:1994 + A1:1997 + A2:2000 |
| 51842 |
DIN EN 60169-21Radio-frequency connectors - Part 21: Two types of radio-frequency connectors with inner diameter of outer conductor 9,5 mm (O,374 in) with different versions of screw coupling - Characteristic impedance 50 Ώ (Types SC-A and SC-B) (IEC 60169-21:1985 + A1:1996); German version EN 60169-21:1997 Radio-frequency connectors - Part 21: Two types of radio-frequency connectors with inner diameter of outer conductor 9,5 mm (O,374 in) with different versions of screw coupling - Characteristic impedance 50 Ώ (Types SC-A and SC-B) (IEC 60169-21:1985 + A1:1996); German version EN 60169-21:1997 |
| 51843 |
DIN EN 60169-23Radio-frequency connectors; part 23: pin and socket connector for use with 3,5 mm rigid precision coaxial lines with inner diameter of outer conductor 3,5 mm (IEC 60169-23:1991); German version EN 60169-23:1993 Radio-frequency connectors; part 23: pin and socket connector for use with 3,5 mm rigid precision coaxial lines with inner diameter of outer conductor 3,5 mm (IEC 60169-23:1991); German version EN 60169-23:1993 |
| 51844 |
DIN EN 60169-24Radio-frequency connectors; part 24: radio-frequency coaxial connectors with screw coupling, typically for use in 75 ohm cable distribution systems (type F) (IEC 60169-24:1991); German version EN 60169-24:1993 Radio-frequency connectors; part 24: radio-frequency coaxial connectors with screw coupling, typically for use in 75 ohm cable distribution systems (type F) (IEC 60169-24:1991); German version EN 60169-24:1993 |
| 51845 |
DIN EN 60169-25Radio-frequency connectors; part 25: two-pole screw (3/4-20 UNEF) coupled connectors for use with shielded balanced cables having twin inner conductors with inner diameter of outer conductor 13,56 mm (type TWHN) (IEC 60169-25:1992); German version EN 60169-25:1993 Radio-frequency connectors; part 25: two-pole screw (3/4-20 UNEF) coupled connectors for use with shielded balanced cables having twin inner conductors with inner diameter of outer conductor 13,56 mm (type TWHN) (IEC 60169-25:1992); German version EN 60169-25:1993 |
| 51846 |
DIN EN 60172Test procedure for the determination of the temperature index of enamelled and tape wrapped winding wires (IEC 60172:2015); German version EN 60172:2015 Test procedure for the determination of the temperature index of enamelled and tape wrapped winding wires (IEC 60172:2015); German version EN 60172:2015 |
| 51847 |
DIN EN 6018Aerospace series - Test methods for metallic materials - Determination of density according to displacement method; German and English version EN 6018:2017 Aerospace series - Test methods for metallic materials - Determination of density according to displacement method; German and English version EN 6018:2017 |
| 51848 |
DIN EN 60188High-pressure mercury vapour lamps - Performance specifications (IEC 60188:2001); German version EN 60188:2001 High-pressure mercury vapour lamps - Performance specifications (IEC 60188:2001); German version EN 60188:2001 |
| 51849 |
DIN EN 60188/AAHigh-pressure mercury vapour lamps - Performance specifications; German version EN 60188:2001/prAA:2017 High-pressure mercury vapour lamps - Performance specifications; German version EN 60188:2001/prAA:2017 |
| 51850 |
DIN EN 6019Aerospace series; test methods for metallic materials; recommended practice for R-curve and KCO determination Aerospace series; test methods for metallic materials; recommended practice for R-curve and KCO determination |
| 51851 |
DIN EN 60191-3Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits (IEC 60191-3:1999); German version EN 60191-3:1999 Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits (IEC 60191-3:1999); German version EN 60191-3:1999 |
| 51852 |
DIN EN 60191-3 Beiblatt 1Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Supplement 1: Extract of the terms Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Supplement 1: Extract of the terms |
| 51853 |
DIN EN 60191-4Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013 + A1:2018); German version EN 60191-4:2014 + A1:2018 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013 + A1:2018); German version EN 60191-4:2014 + A1:2018 |
| 51854 |
DIN EN 60191-6Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009); German version EN 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009); German version EN 60191-6:2009 |
| 51855 |
DIN EN 60191-6-1Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals (IEC 60191-6-1:2001); German version EN 60191-6-1:2001 Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals (IEC 60191-6-1:2001); German version EN 60191-6-1:2001 |
| 51856 |
DIN EN 60191-6-10Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON (IEC 60191-6-10:2003); German version EN 60191-6-10:2003 Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON (IEC 60191-6-10:2003); German version EN 60191-6-10:2003 |
| 51857 |
DIN EN 60191-6-12Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA) (IEC 60191-6-12:2011); German version EN 60191-6-12:2011 Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA) (IEC 60191-6-12:2011); German version EN 60191-6-12:2011 |
| 51858 |
DIN EN 60191-6-13Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) (IEC 60191-6-13:2016); German version EN 60191-6-13:2016 Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) (IEC 60191-6-13:2016); German version EN 60191-6-13:2016 |
| 51859 |
DIN EN 60191-6-16Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA (IEC 60191-6-16:2007); German version EN 60191-6-16:2007 Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA (IEC 60191-6-16:2007); German version EN 60191-6-16:2007 |
| 51860 |
DIN EN 60191-6-17Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) (IEC 60191-6-17:2011); German version EN 60191-6-17:2011 Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) (IEC 60191-6-17:2011); German version EN 60191-6-17:2011 |
