Tra cứu Tiêu chuẩn quốc tế
Tìm thấy 73948 kết quả.
Searching result
| 53241 |
DIN EN 60747-5-1*VDE 0884-1Discrete semiconductor devices and integrated circuits - Part 5-1: Optoelectronic devices; General (IEC 60747-5-1:1997 + A1:2001 + A2:2002); German version EN 60747-5-1:2001 + A1:2002 + A2:2002 Discrete semiconductor devices and integrated circuits - Part 5-1: Optoelectronic devices; General (IEC 60747-5-1:1997 + A1:2001 + A2:2002); German version EN 60747-5-1:2001 + A1:2002 + A2:2002 |
| 53242 |
DIN EN 60747-5-2*VDE 0884-2Discrete semiconductor devices and integrated circuits - Part 5-2: Optoelectronic devices; Essential ratings and characteristics (IEC 60747-5-2:1997 + A1:2002); German version EN 60747-5-2:2001 + A1:2002 Discrete semiconductor devices and integrated circuits - Part 5-2: Optoelectronic devices; Essential ratings and characteristics (IEC 60747-5-2:1997 + A1:2002); German version EN 60747-5-2:2001 + A1:2002 |
| 53243 |
DIN EN 60747-5-3*VDE 0884-3Discrete semiconductor devices and integrated circuits - Part 5-3: Optoelectronic devices; Measuring methods (IEC 60747-5-3:1997 + A1:2002); German version EN 60747-5-3:2001 + A1:2002 Discrete semiconductor devices and integrated circuits - Part 5-3: Optoelectronic devices; Measuring methods (IEC 60747-5-3:1997 + A1:2002); German version EN 60747-5-3:2001 + A1:2002 |
| 53244 |
DIN EN 60747-5-5*VDE 0884-5Semiconductor devices - Discrete devices - Part 5-5: Optoelectronic devices - Photocouplers (IEC 60747-5-5:2007 + A1:2013); German version EN 60747-5-5:2011 + A1:2015 Semiconductor devices - Discrete devices - Part 5-5: Optoelectronic devices - Photocouplers (IEC 60747-5-5:2007 + A1:2013); German version EN 60747-5-5:2011 + A1:2015 |
| 53245 |
DIN EN 60747-5-6Semiconductor devices - Discrete devices - Part 5-6: Optoelectronic devices - Light emitting diodes (IEC 47E/418/CD:2011) Semiconductor devices - Discrete devices - Part 5-6: Optoelectronic devices - Light emitting diodes (IEC 47E/418/CD:2011) |
| 53246 |
DIN EN 60747-5-7Semiconductor devices - Discrete devices - Part 5-7: Optoelectronic devices - Photodiodes and phototransistors (IEC 47E/420/CD:2011) Semiconductor devices - Discrete devices - Part 5-7: Optoelectronic devices - Photodiodes and phototransistors (IEC 47E/420/CD:2011) |
| 53247 |
DIN EN 60747-6Semiconductor devices - Discrete devices - Part 6: Thyristors (IEC 47E/444/CD:2012) Semiconductor devices - Discrete devices - Part 6: Thyristors (IEC 47E/444/CD:2012) |
| 53248 |
DIN EN 60749-1Semiconductor devices - Mechanical and climatic test methods - Part 1: General (IEC 60749-1:2002 + Corr. 1:2003); German version EN 60749-1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 1: General (IEC 60749-1:2002 + Corr. 1:2003); German version EN 60749-1:2003 |
| 53249 |
DIN EN 60749-10Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock (IEC 60749-10:2002); German version EN 60749-10:2002 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock (IEC 60749-10:2002); German version EN 60749-10:2002 |
| 53250 |
DIN EN 60749-11Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature; Two-fluid-bath method (IEC 60749-11:2002); German version EN 60749-11:2002 Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature; Two-fluid-bath method (IEC 60749-11:2002); German version EN 60749-11:2002 |
| 53251 |
DIN EN 60749-14Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) (IEC 60749-14:2003); German version EN 60749-14:2003 Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) (IEC 60749-14:2003); German version EN 60749-14:2003 |
| 53252 |
DIN EN 60749-15Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2010); German version EN 60749-15:2010 + AC:2011 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2010); German version EN 60749-15:2010 + AC:2011 |
| 53253 |
DIN EN 60749-16Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) (IEC 60749-16:2003); German version EN 60749-16:2003 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) (IEC 60749-16:2003); German version EN 60749-16:2003 |
| 53254 |
DIN EN 60749-17Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation (IEC 60749-17:2003); German version EN 60749-17:2003 Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation (IEC 60749-17:2003); German version EN 60749-17:2003 |
| 53255 |
DIN EN 60749-17*VDE 0884-749-17Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation (IEC 47/2465/CDV:2018); German and English version prEN 60749-17:2018 Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation (IEC 47/2465/CDV:2018); German and English version prEN 60749-17:2018 |
| 53256 |
DIN EN 60749-18Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose) (IEC 60749-18:2002); German version EN 60749-18:2003 Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose) (IEC 60749-18:2002); German version EN 60749-18:2003 |
| 53257 |
DIN EN 60749-19Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 60749-19:2003 + A1:2010); German version EN 60749-19:2003 + A1:2010 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 60749-19:2003 + A1:2010); German version EN 60749-19:2003 + A1:2010 |
| 53258 |
DIN EN 60749-2Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure (IEC 60749-2:2002); German version EN 60749-2:2002 Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure (IEC 60749-2:2002); German version EN 60749-2:2002 |
| 53259 |
DIN EN 60749-20Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2008); German version EN 60749-20:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2008); German version EN 60749-20:2009 |
| 53260 |
DIN EN 60749-20-1Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 60749-20-1:2009); German version EN 60749-20-1:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 60749-20-1:2009); German version EN 60749-20-1:2009 |
