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| 54241 |
DIN EN 61188-1-1Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements; flatness considerations for electronic assemblies (IEC 61188-1-1:1997); German version EN 61188-1-1:1997 Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements; flatness considerations for electronic assemblies (IEC 61188-1-1:1997); German version EN 61188-1-1:1997 |
| 54242 |
DIN EN 61188-1-2Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements; controlled impedance (IEC 61188-1-2:1998); German version EN 61188-1-2:1998 Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements; controlled impedance (IEC 61188-1-2:1998); German version EN 61188-1-2:1998 |
| 54243 |
DIN EN 61188-5-1Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements (IEC 61188-5-1:2002); German version EN 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements (IEC 61188-5-1:2002); German version EN 61188-5-1:2002 |
| 54244 |
DIN EN 61188-5-2Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components (IEC 61188-5-2:2003); German version EN 61188-5-2:2003 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components (IEC 61188-5-2:2003); German version EN 61188-5-2:2003 |
| 54245 |
DIN EN 61188-5-3Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides (IEC 61188-5-3:2007); German version EN 61188-5-3:2007 Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides (IEC 61188-5-3:2007); German version EN 61188-5-3:2007 |
| 54246 |
DIN EN 61188-5-4Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides (IEC 61188-5-4:2007); German version EN 61188-5-4:2007 Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides (IEC 61188-5-4:2007); German version EN 61188-5-4:2007 |
| 54247 |
DIN EN 61188-5-5Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides (IEC 61188-5-5:2007); German version EN 61188-5-5:2007 Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides (IEC 61188-5-5:2007); German version EN 61188-5-5:2007 |
| 54248 |
DIN EN 61188-5-6Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations; Chip carriers with J-leads on four sides (IEC 61188-5-6:2003); German version EN 61188-5-6:2003 Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations; Chip carriers with J-leads on four sides (IEC 61188-5-6:2003); German version EN 61188-5-6:2003 |
| 54249 |
DIN EN 61188-5-8Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) (IEC 61188-5-8:2007); German version EN 61188-5-8:2008 Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) (IEC 61188-5-8:2007); German version EN 61188-5-8:2008 |
| 54250 |
DIN EN 61188-6-4Printed boards and printed board assemblies - Design and use - Part 6-4: Generic requirements for dimensional drawings of SMDs from viewpoint of land-pattern design (IEC 91/1452/CD:2017) Printed boards and printed board assemblies - Design and use - Part 6-4: Generic requirements for dimensional drawings of SMDs from viewpoint of land-pattern design (IEC 91/1452/CD:2017) |
| 54251 |
DIN EN 61188-7Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (IEC 61188-7:2017); German version EN 61188-7:2017 Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (IEC 61188-7:2017); German version EN 61188-7:2017 |
| 54252 |
DIN EN 61189-1Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 1: General test methods and methodology (IEC 61189-1:1997 + A1:2001); German version EN 61189-1:1997 + A1:2001 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 1: General test methods and methodology (IEC 61189-1:1997 + A1:2001); German version EN 61189-1:1997 + A1:2001 |
| 54253 |
DIN EN 61189-11Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys (IEC 61189-11:2013); German version EN 61189-11:2013 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys (IEC 61189-11:2013); German version EN 61189-11:2013 |
| 54254 |
DIN EN 61189-2Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures (IEC 61189-2:2006); German version EN 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures (IEC 61189-2:2006); German version EN 61189-2:2006 |
| 54255 |
DIN EN 61189-2-719Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz) (IEC 61189-2-719:2016); German version EN 61189-2-719:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz) (IEC 61189-2-719:2016); German version EN 61189-2-719:2016 |
| 54256 |
DIN EN 61189-3Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) (IEC 61189-3:2007); German version EN 61189-3:2008 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) (IEC 61189-3:2007); German version EN 61189-3:2008 |
| 54257 |
DIN EN 61189-2-721Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator (IEC 61189-2-721:2015); German version EN 61189-2-721:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator (IEC 61189-2-721:2015); German version EN 61189-2-721:2015 |
| 54258 |
DIN EN 61189-3-719Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling (IEC 61189-3-719:2016); German version EN 61189-3-719:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling (IEC 61189-3-719:2016); German version EN 61189-3-719:2016 |
| 54259 |
DIN EN 61189-3-913Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit board for high-brightness LEDs (IEC 91/1186/CD:2014) Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit board for high-brightness LEDs (IEC 91/1186/CD:2014) |
| 54260 |
DIN EN 61189-5Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies (IEC 61189-5:2006); German version EN 61189-5:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies (IEC 61189-5:2006); German version EN 61189-5:2006 |
