Tra cứu Tiêu chuẩn quốc tế
Tìm thấy 1200 kết quả.
Searching result
| 541 |
IEC 60191-2:1966/AMD5:2002
Amendment 5 - Mechanical standardization of semiconductor devices. Part 2: Dimensions |
| 542 |
IEC 60191-2:1966/AMD6:2002
Amendment 6 - Mechanical standardization of semiconductor devices. Part 2: Dimensions |
| 543 |
IEC 60191-2:1966/AMD7:2002
Amendment 7 - Mechanical standardization of semiconductor devices. Part 2: Dimensions |
| 544 |
ASTM B601-01Standard Classification for Temper Designations for Copper and Copper Alloys-Wrought and Cast Standard Classification for Temper Designations for Copper and Copper Alloys-Wrought and Cast |
| 545 |
EN 60601-1-1:2001Medical electrical equipment - Part 1-1: General requirements for safety - Collateral standard: Safety requirements for medical electrical systemsIEC 60601-1-1:2000 Medical electrical equipment - Part 1-1: General requirements for safety - Collateral standard: Safety requirements for medical electrical systemsIEC 60601-1-1:2000 |
| 546 |
EN 60601-2-45:2001Medical electrical equipment -- Part 2-45: Particular requirements for the safety of mammographic X-ray equipment and mammographic stereotactic devicesIEC 60601-2-45:2001 Medical electrical equipment -- Part 2-45: Particular requirements for the safety of mammographic X-ray equipment and mammographic stereotactic devicesIEC 60601-2-45:2001 |
| 547 |
EN 60601-2-47:2001Medical electrical equipment - Part 2-47: Particular requirements for the safety, including essential performance, of ambulatory electrocardiographic systemsIEC 60601-2-47:2001 Medical electrical equipment - Part 2-47: Particular requirements for the safety, including essential performance, of ambulatory electrocardiographic systemsIEC 60601-2-47:2001 |
| 548 |
EN 60601-2-49:2001Medical electrical equipment - Part 2-49: Particular requirements for the safety of multifunction patient monitoring equipmentIEC 60601-2-49:2001 Medical electrical equipment - Part 2-49: Particular requirements for the safety of multifunction patient monitoring equipmentIEC 60601-2-49:2001 |
| 549 |
|
| 550 |
|
| 551 |
IEC 60191-2:1966/AMD1:2001
Amendment 1 - Mechanical standardization of semiconductor devices - Part 2: Dimensions |
| 552 |
IEC 60191-2:1966/AMD2:2001
Amendment 2 - Mechanical standardization of semiconductor devices - Part 2: Dimensions |
| 553 |
IEC 60191-2:1966/AMD3:2001
Amendment 3 - Mechanical standardization of semiconductor devices - Part 2: Dimensions |
| 554 |
IEC 60191-2:1966/AMD4:2001
Amendment 4 - Mechanical standardization of semiconductor devices - Part 2: Dimensions |
| 555 |
IEC 60191-6-1:2001
Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals |
| 556 |
IEC 60191-6-2:2001
Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages |
| 557 |
IEC 60191-6-5:2001
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) |
| 558 |
IEC 60191-6-6:2001
Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA) |
| 559 |
IEC 60191-6-8:2001
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP) |
| 560 |
|
