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| 51861 |
DIN EN 60191-6-18Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (IEC 60191-6-18:2010 + Cor. :2010); German version EN 60191-6-18:2010 Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (IEC 60191-6-18:2010 + Cor. :2010); German version EN 60191-6-18:2010 |
| 51862 |
DIN EN 60191-6-19Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (IEC 60191-6-19:2010); German version EN 60191-6-19:2010 Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (IEC 60191-6-19:2010); German version EN 60191-6-19:2010 |
| 51863 |
DIN EN 60191-6-2Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages (IEC 60191-6-2:2001); German version EN 60191-6-2:2002 Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages (IEC 60191-6-2:2001); German version EN 60191-6-2:2002 |
| 51864 |
DIN EN 60191-6-20Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010); German version EN 60191-6-20:2010 Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010); German version EN 60191-6-20:2010 |
| 51865 |
DIN EN 60191-6-21Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010); German version EN 60191-6-21:2010 Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010); German version EN 60191-6-21:2010 |
| 51866 |
DIN EN 60191-6-22Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (IEC 60191-6-22:2012); German version EN 60191-6-22:2013 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (IEC 60191-6-22:2012); German version EN 60191-6-22:2013 |
| 51867 |
DIN EN 60191-6-3Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quat flat packs (QFP) (IEC 60191-6-3:2000); German version EN 60191-6-3:2000 Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quat flat packs (QFP) (IEC 60191-6-3:2000); German version EN 60191-6-3:2000 |
| 51868 |
DIN EN 60191-6-4Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (IEC 60191-6-4:2003); German version EN 60191-6-4:2003 Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (IEC 60191-6-4:2003); German version EN 60191-6-4:2003 |
| 51869 |
DIN EN 60191-6-5Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA) (IEC 60191-6-5:2001); German version EN 60191-6-5:2001 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA) (IEC 60191-6-5:2001); German version EN 60191-6-5:2001 |
| 51870 |
DIN EN 60191-6-6Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine pitch land grid array (FLGA) (IEC 60191-6-6:2001); German version EN 60191-6-6:2001 Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine pitch land grid array (FLGA) (IEC 60191-6-6:2001); German version EN 60191-6-6:2001 |
| 51871 |
DIN EN 60191-6-8Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP) (IEC 60191-6-8:2001); German version EN 60191-6-8:2001 Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP) (IEC 60191-6-8:2001); German version EN 60191-6-8:2001 |
| 51872 |
DIN EN 60192Low-pressure sodium vapour lamps - Performance specifications (IEC 60192:2001); German version EN 60192:2001 Low-pressure sodium vapour lamps - Performance specifications (IEC 60192:2001); German version EN 60192:2001 |
| 51873 |
DIN EN 60194Printed board design, manufacture and assembly - Terms and definitions (IEC 60194:2006); German version EN 60194:2006, text in English Printed board design, manufacture and assembly - Terms and definitions (IEC 60194:2006); German version EN 60194:2006, text in English |
| 51874 |
DIN EN 60195Method of measurement of current noise generated in fixed resistors (IEC 60195:2016); German version EN 60195:2016 Method of measurement of current noise generated in fixed resistors (IEC 60195:2016); German version EN 60195:2016 |
| 51875 |
DIN EN 60196*VDE 0175-3IEC standard frequencies (IEC 60196:2009); German version EN 60196:2009 IEC standard frequencies (IEC 60196:2009); German version EN 60196:2009 |
| 51876 |
DIN EN 602Aluminium and aluminium alloys - Wrought products - Chemical composition of semi-finished products used for the fabrication of articles for use in contact with foodstuff; German version EN 602:2004 Aluminium and aluminium alloys - Wrought products - Chemical composition of semi-finished products used for the fabrication of articles for use in contact with foodstuff; German version EN 602:2004 |
| 51877 |
DIN EN 60204-1*VDE 0113-1Safety of machinery - Electrical equipment of machines - Part 1: General requirements (IEC 60204-1:2016, modified); German version EN 60204-1:2018 Safety of machinery - Electrical equipment of machines - Part 1: General requirements (IEC 60204-1:2016, modified); German version EN 60204-1:2018 |
| 51878 |
DIN EN 60204-11 Berichtigung 1*VDE 0113-11 BerichtSafety of machinery - Electrical equipment of machines - Part 11: Requirements for HV equipment for voltages above 1000 V a.c. or 1500 V d.c. and not exceeding 36 kV (IEC 60204-11:2000); German version EN 60204-11:2000, Corrigendum to DIN EN 60204-11 (VDE 0113-11):2001-05; German version CENELEC-Cor. :2010 to EN 60204-11:2000 Safety of machinery - Electrical equipment of machines - Part 11: Requirements for HV equipment for voltages above 1000 V a.c. or 1500 V d.c. and not exceeding 36 kV (IEC 60204-11:2000); German version EN 60204-11:2000, Corrigendum to DIN EN 60204-11 (VDE 0113-11):2001-05; German version CENELEC-Cor. :2010 to EN 60204-11:2000 |
| 51879 |
DIN EN 60204-11*VDE 0113-11Safety of machinery - Electrical equipment of machines - Part 11: Requirements for HV equipment for voltages above 1000 V a.c. or 1500 V d.c and not exceeding 36 kV (IEC 60204-11:2000); German version EN 60204-11:2000 Safety of machinery - Electrical equipment of machines - Part 11: Requirements for HV equipment for voltages above 1000 V a.c. or 1500 V d.c and not exceeding 36 kV (IEC 60204-11:2000); German version EN 60204-11:2000 |
| 51880 |
DIN EN 60204-31*VDE 0113-31Safety of machinery - Electrical equipment of machines - Part 31: Particular safety and EMC requirements for sewing machines, units and systems (IEC 60204-31:2013); German version EN 60204-31:2013 Safety of machinery - Electrical equipment of machines - Part 31: Particular safety and EMC requirements for sewing machines, units and systems (IEC 60204-31:2013); German version EN 60204-31:2013 |
