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| 5181 |
BS IEC 62862-3-1:2022Solar thermal electric plants. Systems and components. General requirements for the design of parabolic-trough solar thermal power plants. Solar thermal electric plants. Systems and components. General requirements for the design of parabolic-trough solar thermal power plants. |
| 5182 |
BS IEC 62862-4-1:2022Solar thermal electric plants. General requirements for the design of solar power tower plants. Solar thermal electric plants. General requirements for the design of solar power tower plants. |
| 5183 |
BS IEC 62862-5-2:2022Solar thermal electric plants. Systems and components. General requirements and test methods for large-size linear Fresnel collectors. Solar thermal electric plants. Systems and components. General requirements and test methods for large-size linear Fresnel collectors. |
| 5184 |
BS IEC 62899-201-2:2021Printed electronics. Materials. Substrates. Measurement methods for properties of stretchable substrates. Printed electronics. Materials. Substrates. Measurement methods for properties of stretchable substrates. |
| 5185 |
BS IEC 62906-5-5:2022Laser displays. Optical measuring methods of raster-scanning retina direct projection laser displays. Laser displays. Optical measuring methods of raster-scanning retina direct projection laser displays. |
| 5186 |
BS IEC 62906-5-7:2022Laser displays. Measuring methods of image quality affected by speckle for scanning laser displays. Laser displays. Measuring methods of image quality affected by speckle for scanning laser displays. |
| 5187 |
BS IEC 62951-9:2022Semiconductor devices. Flexible and stretchable semiconductor devices. Performance testing methods of one transistor and one resistor (1T1R) resistive memory cells. Semiconductor devices. Flexible and stretchable semiconductor devices. Performance testing methods of one transistor and one resistor (1T1R) resistive memory cells. |
| 5188 |
BS IEC 63068-4:2022Semiconductor devices. Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices. Procedure for identifying and evaluating defects using a combined method of optical inspection and photoluminescence. Semiconductor devices. Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices. Procedure for identifying and evaluating defects using a combined method of optical inspection and photoluminescence. |
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| 5190 |
BS IEC 63145-21-20:2022Eyewear display. Specific measurement methods for VR image quality. Screen door effect. Eyewear display. Specific measurement methods for VR image quality. Screen door effect. |
| 5191 |
BS IEC 63171-4:2022Connectors for electrical and electronic equipment. Detail specification for shielded or unshielded, free and fixed connectors with up to 8 ways for balanced single-pair data transmission with current carrying capacity. Mechanical mating information, pin assignment and additional requirements for Type 4. Connectors for electrical and electronic equipment. Detail specification for shielded or unshielded, free and fixed connectors with up to 8 ways for balanced single-pair data transmission with current carrying capacity. Mechanical mating information, pin assignment and additional requirements for Type 4. |
| 5192 |
BS IEC 63275-1:2022Semiconductor devices. Reliability test method for silicon carbide discrete metal-oxide semiconductor field effect transistors. Test method for bias temperature instability. Semiconductor devices. Reliability test method for silicon carbide discrete metal-oxide semiconductor field effect transistors. Test method for bias temperature instability. |
| 5193 |
BS IEC SRD 63188:2022Smart cities reference architecture methodology. Smart cities reference architecture methodology. |
| 5194 |
BS IEC SRD 63233-1:2022Smart city standards inventory and mapping. Methodology. Smart city standards inventory and mapping. Methodology. |
| 5195 |
BS IEC/IEEE 62582-2:2022-TCTracked Changes. Nuclear power plants. Instrumentation and control important to safety. Electrical equipment condition monitoring methods. Indenter measurements. Tracked Changes. Nuclear power plants. Instrumentation and control important to safety. Electrical equipment condition monitoring methods. Indenter measurements. |
| 5196 |
BS IEC/IEEE 80005-1:2019/A1:2022Utility connections in port. High voltage shore connection (HVSC) systems. General requirements. Utility connections in port. High voltage shore connection (HVSC) systems. General requirements. |
| 5197 |
BS ISO IEC IEEE 8802-22:2022Telecommunications and information exchange between systems. Wireless Regional Area Networks (WRAN). Specific requirements. Cognitive Wireless RAN Medium Access Control (MAC) and Physical Layer (PHY) Specifications: Policies and procedures for operation in the bands that allow spectrum sharing where the communications devices may opportunistically operate in the spectrum of primary service. Telecommunications and information exchange between systems. Wireless Regional Area Networks (WRAN). Specific requirements. Cognitive Wireless RAN Medium Access Control (MAC) and Physical Layer (PHY) Specifications: Policies and procedures for operation in the bands that allow spectrum sharing where the communications devices may opportunistically operate in the spectrum of primary service. |
| 5198 |
BS ISO/IEC 15946-5:2022-TCTracked Changes. Information security. Cryptographic techniques based on elliptic curves. Elliptic curve generation. Tracked Changes. Information security. Cryptographic techniques based on elliptic curves. Elliptic curve generation. |
| 5199 |
BS ISO/IEC 17021-13:2021Conformity assessment. Requirements for bodies providing audit and certification of management systems. Competence requirements for auditing and certification of compliance management systems. Conformity assessment. Requirements for bodies providing audit and certification of management systems. Competence requirements for auditing and certification of compliance management systems. |
| 5200 |
BS ISO/IEC 17060:2022Conformity assessment. Code of good practice. Conformity assessment. Code of good practice. |
